?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic chip / high voltage metric code eia size code l - length w - width b - bandwidth band separation 2012 0805 2.0 (0.079) 0.2 (0.008) 1.2 (0.049) 0.2 (0.008) 0.5 (0.02 ?.25 (0.010) 0.75 (0.030) 3216 1206 3.2 (0.126) 0.2 (0.008) 1.6 (0.063) 0.2 (0.008) 0.5 (0.02) 0.25 (0.010) n/a 3225 1210 3.2 (0.126) 0.2 (0.008) 2.5 (0.098) 0.2 (0.008) 0.5 (0.02) 0.25 (0.010) n/a 4520 1808 4.5 (0.177) 0.3 (0.012) 2.0 (0.079 0.2 (0.008) 0.6 (0.024) 0.35 (0.014) n/a 4532 1812 4.5 (0.177) 0.3 (0.012) 3.2 (0.126) 0.3 (0.012) 0.6 (0.024) 0.35 (0.014) n/a 4564 1825 4.5 (0.177) 0.3 (0.012) 6.4 (0.250) 0.4 (0.016) 0.6 (0.024) 0.35 (0.014) n/a 5650 2220 5.6 (0.224) 0.4 (0.016) 5.0 (0.197) 0.4 (0.016) 0.6 (0.024) 0.35 (0.014) n/a 5664 2225 5.6 (0.224) 0.4 (0.016) 6.4 (0.250) 0.4 (0.016) 0.6 (0.024) 0.35 (0.014) n/a outline drawing kemet's high voltage surface mount capacitors are designed to withstand high voltage applications. they offer high capacitance with low leakage current and low esr at high frequency. the capacitors have pure tin (sn) plated external electrodes for good solderability. x7r dielectrics are not designed for ac line filtering applications. an insulating coating may be required to prevent surface arcing. these components are rohs compliant. applications markets switch mode power supply power supply input filter high voltage power supply resonators dc-dc converter tank circuit lcd fluorescent backlight ballast snubber circuit hid lighting output filter telecommunications equipment high voltage coupling industrial equipment/control high voltage dc blocking medical equipment/control lighting ballast computer (lan/wan interface) voltage multiplier circuits analog and digital modems coupling capacitor/cuk automotive applications markets outline drawing table 1 - dimensions - millimeters (in.) w l t b s tin plate nickel plate conductive metallization electrodes 81 ceramic surface mount
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic chip / high voltage * contact kemet sales representative for c, d, f & g capacitance tolerance availability. note: actual thickness dimensions may be less than stated maximum. check the kemet website, www.kemet.com, for additional values and chip sizes available. pg ceramic surface mount c0g dielectric capacitance values and thickness targets (in.) series max thickness (in) 0. 050 0. 050 0. 065 0. 065 0. 065 0. 065 0. 101 0. 101 0. 101 0. 101 0. 080 0. 080 0. 080 0. 080 0. 080 0. 080 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 cap code/ voltage 500 1000 500 1000 1500 2000 500 1000 1500 2000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 1.0-2.4 c,d 109-249 2.7-5.1 c,d k,m 279-519 5.6-9.1 c,d j,k,m 569-919 10 c,d j,k,m 100 11 c,d j,k,m 110 12 c,d j,k,m 120 13 c,d j,k,m 130 15 c,d g,j,k,m 150 16 c,d g,j,k,m 160 18 c,d g,j,k,m 180 20 c,d g,j,k,m 200 22 c,d g,j,k,m 220 24 c,d g,j,k,m 240 27 d,f,g,j,k,m 270 30 d,f,g,j,k,m 300 33 d,f,g,j,k,m 330 36 d,f,g,j,k,m 360 39 d,f,g,j,k,m 390 43 d,f,g,j,k,m 430 47 d,f,g,j,k,m 470 51 d,f,g,j,k,m 510 56 f,g,j,k,m 560 62 f,g,j,k,m 620 68 f,g,j,k,m 680 75 f,g,j,k,m 750 82 f,g,j,k,m 820 91 f,g,j,k,m 910 100 f,g,j,k,m 101 110 f,g,j,k,m 111 120 f,g,j,k,m 121 130 f,g,j,k,m 131 150 f,g,j,k,m 151 160 f,g,j,k,m 161 180 f,g,j,k,m 181 200 f,g,j,k,m 201 220 f,g,j,k,m 221 240 f,g,j,k,m 241 270 f,g,j,k,m 271 300 f,g,j,k,m 301 330 f,g,j,k,m 331 360 f,g,j,k,m 361 390 f,g,j,k,m 391 430 f,g,j,k,m 431 470 f,g,j,k,m 471 510 f,g,j,k,m 511 560 f,g,j,k,m 561 620 f,g,j,k,m 621 680 f,g,j,k,m 681 750 f,g,j,k,m 751 820 f,g,j,k,m 821 910 f,g,j,k,m 911 1000 f,g,j,k,m 102 1100 f,g,j,k,m 112 1200 f,g,j,k,m 122 1300 f,g,j,k,m 132 1500 f,g,j,k,m 152 1600 f,g,j,k,m 162 1800 f,g,j,k,m 182 2000 f,g,j,k,m 202 2200 f,g,j,k,m 222 2400 f,g,j,k,m 242 2700 f,g,j,k,m 272 3000 f,g,j,k,m 302 3300 f,g,j,k,m 332 3600 f,g,j,k,m 362 3900 f,g,j,k,m 392 4300 f,g,j,k,m 432 4700 f,g,j,k,m 472 5100 f,g,j,k,m 512 5600 f,g,j,k,m 562 6200 f,g,j,k,m 622 6800 f,g,j,k,m 682 7500 f,g,j,k,m 752 8200 f,g,j,k,m 822 9100 f,g,j,k,m 912 10,000 f,g,j,k,m 103 2225 cap pf capacitance tolerance * 1825 2220 1812 0805 1206 1210 1808 82
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic chip / high voltage note: actual thickness dimensions may be less than stated maximum. check the kemet website, www.kemet.com, for additional values and chip sizes available. pg x7r dielectric capacitance values and thickness targets (in.) eia metric 0805 2012 0.055 1.27 8 2,500 10,000 1206 3216 0.065 1.65 8 2,000 8,000 1210 3225 0.101 2.57 8 2,000 8,000 1808 4520 0.080 2.03 12 1,000 4,000 1812/1813 4532 0.067 1.70 12 1,000 4,000 1825 4564 0.067 1.70 12 1,000 4,000 2220 5650 0.067 1.70 12 1,000 4,000 2225 5664 0.067 1.70 12 1,000 4,000 qty per reel 7" plastic qty per reel 13" plastic kemet high voltage surface mount chip (voltage codes c,d,f,g,h, and z) thickness and reeling quantities chip size max. thickness (in) max. thickness (mm) tape width (mm) series max thickness (in) 0. 050 0. 050 0. 065 0. 065 0. 065 0. 065 0. 080 0. 080 0. 080 0. 080 0. 080 0. 080 0. 080 0. 080 0. 080 0. 080 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 0. 067 cap code/ voltage 500 1000 500 1000 1500 2000 500 1000 1500 2000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 10 j,k,m 100 11 j,k,m 110 12 j,k,m 120 13 j,k,m 130 15 j,k,m 150 16 j,k,m 160 18 j,k,m 180 20 j,k,m 200 22 j,k,m 220 24 j,k,m 240 27 j,k,m 270 30 j,k,m 300 33 j,k,m 330 36 j,k,m 360 39 j,k,m 390 43 j,k,m 430 47 j,k,m 470 51 j,k,m 510 56 j,k,m 560 62 j,k,m 620 68 j,k,m 680 75 j,k,m 750 82 j,k,m 820 91 j,k,m 910 100 j,k,m 101 110 j,k,m 111 120 j,k,m 121 130 j,k,m 131 150 j,k,m 151 180 j,k,m 181 220 j,k,m 221 270 j,k,m 271 330 j,k,m 331 390 j,k,m 391 470 j,k,m 471 560 j,k,m 561 680 j,k,m 681 820 j,k,m 821 1000 j,k,m 102 1200 j,k,m 122 1500 j,k,m 152 1800 j,k,m 182 2000 j,k,m 202 2200 j,k,m 222 2700 j,k,m 272 3300 j,k,m 332 3900 j,k,m 392 4700 j,k,m 472 5600 j,k,m 562 6800 j,k,m 682 8200 j,k,m 822 10,000 j,k,m 103 12,000 j,k,m 123 15,000 j,k,m 153 18,000 j,k,m 183 22,000 j,k,m 223 27,000 j,k,m 273 33,000 j,k,m 333 39,000 j,k,m 393 47,000 j,k,m 473 56,000 j,k,m 563 62,000 j,k,m 623 68,000 j,k,m 683 82,000 j,k,m 823 100,000 j,k,m 104 120,000 j,k,m 124 150,000 j,k,m 154 180,000 j,k,m 184 220,000 j,k,m 224 2225 cap pf capacitance tolerance 1825 2220 1812 0805 1206 1210 1808 83 ceramic surface mount
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic chip / high voltage c 0805 c 102 k c r a c style c - ceramic chip size 0805; 1206; 1210; 1808; 1812; 1825; 2220; 2225 specification c - standard capacitance code, pf first two digits represent significant figures. third digit specifies number of zeros. 100 pf = 101. (use 9 for 1.0 through 9.9 pf) (use 8 for 0.1 through .99 pf) capacitance tolerance c = 0.25pf* j = 5% d = 0.5pf* k = 10% f = 1%* m = 20% g = 2%* * contact kemet sales for availability. voltage c = 500v g = 2000v d = 1000v z = 2500v f = 1500v h = 3000v temperature characteristic designated by capacitance change over temperature range g (c0g) (30ppm/c) (-55 c +125 c) r x7r (15%) (-55 c +125 c) end metallization c = standard failure rate level a = not applicable capacitor ordering information property specification capacitance c0g: 1 pf to 0.010 f x7r: 10 pf to 0.22 f 25 c, 1.0 0.2 vrms, 1 khz (1 mhz for 1000 pf (c0g only) cap tolerance c0g: c*, d*, f*, g*, j, k, m * contact kemet sales for availability. x7r: j, k, m df c0g: 0.1% max x7r: 2.5% max voltage ratings 500 v, 1000 v, 1500 v, 2000 v, 2500 v, 3000 v operating temperature range from -55c to +125c 25 c ir @ 500v 100 g ? or 1000 m ? -f, whichever is less 125 c ir @ 500v 10 g ? or 100 m ? -f, whichever is less -55 c tcc +125 c tcc x7r: + 15% c0g: + 30 ppm / c dielectric strength 150% of rated voltage for rated voltage <1000 v 120% of rated voltage for rated voltage >=1000v ripple current consult kemet sales representative electrical parameters marking these chips are supplied unmarked. if required, they can be supplied laser-marked at an extra cost. packaging kemet high voltage surface mount mlcc are available packaged in tape and reel configuration, or bulk soldering process the 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. sizes 1210 and larger should be limited to reflow soldering only. all sizes incorporate the standard kemet barrier layer of pure nickel with an overplating of pure tin (sn) for excellent solderability and resistance to solder leaching of recommended solder pad dimensions the termination. bag as outlined on page 8 3 . please consult factory for waffle packaging options. details on the marking format is located on page 9 7. mm in. mm in. mm in. mm in. 0805 3.30 0.130 0.70 0.028 1.60 0.063 1.30 0.051 1206 4.50 0.177 1.50 0.059 2.00 0.079 1.50 0.059 1210 4.50 0.177 1.50 0.059 2.90 0.114 1.50 0.059 1808 5.90 0.232 2.30 0.091 2.40 0.094 1.80 0.071 1812 5.90 0.232 2.30 0.091 3.70 0.146 1.80 0.071 1825 5.90 0.232 2.30 0.091 6.90 0.272 1.80 0.071 2220 7.00 0.276 3.30 0.130 5.50 0.217 1.85 0.073 2225 7.00 0.276 3.30 0.130 6.80 0.268 1.85 0.073 l (pad length) chip size t (total length) s (separation w (pad width) pf from -55oc to +125oc m-w-mscx, x,h%,sau sakx,n-csxa %g%mc,sm-g w-,-n%c%,b n-,gsau w-mg-usau bxgh%,sau w,xm%bb ,%mxnn%ah%h bxgh%, w-h hsn%absxab ac(.x f5qd aq+x adxuqgqu-cq4e f-d-uqc-eux f4mx/ d8 f-d-uqc-eux u4.xp-eux s4.c-2x ux0dxp-ctpx f5-p-ucxpq;cqu 8-q.tpx a-cx tx=x. cem nxc-..q+-cq4e 84
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 kemet offers multilayer ceramic chip capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with eia standard 481-1: taping of surface mount components for automatic handling. this packaging system is compatible with all tape fed automatic pick and place systems. see page 7 8 for details on reeling quantities for commercial chips and page 87 for mil-prf-55681 chips. ceramic chip capacitors packaging information tape & reel packaging 8mm .30 (.315 .012") or 12mm .30 (.472 .012") 178mm (7.00") or 330mm (13.00") anti-static reel embossed carrier* 0402 and 0603 case sizes available on punched paper only. embossment anti-static cover tape (.10mm (.004") max thickness) chip orientation in pocket (except 1825 commercial, and 1825 & 2225 military) * punched paper carrier used for 0402 and 0603 case size. g handling. this packaging system is compatible with all tape fed automatic pick and place systems. see page 81 for details on reeling quantities for commercial chips and page 90 for mil-prf-55681 chips. kemet ? x c g z y grid placement courtyard z 2.14 2.78 3.30 4.50 4.50 5.90 5.90 7.00 7.00 g 0.28 0.68 0.70 1.50 1.50 2.30 2.30 3.30 3.30 x 0.74 1.08 1.60 2.00 2.90 3.70 6.90 5.50 6.80 y(ref) 0.93 1.05 1.30 1.50 1.50 1.80 1.80 1.85 1.85 c(ref) 1.21 1.73 2.00 3.00 3.00 4.10 4.10 5.15 5.15 z 3.18 3.70 4.90 4.90 g 0.68 0.70 1.50 1.50 x 0.80 1.10 1.40 2.00 y(ref) 1.25 1.50 1.70 1.70 smin 1.93 2.20 3.20 3.20 wave solder reflow solder calculation formula z = lmin + 2jt + tt g = smax - 2jh -th x = wmin + 2js + ts tt, th, ts = combined tolerances 0402 0603 0805 1206 1210 1812 1825 2220 2225 dimension not recommended not recommended ! " # $ surface mount land dimensions - ceramic chip capacitors - mm 93 packaging
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 newton to 1.0 newton (10g to 100g) 12 mm 0.1 newton to 1.3 newton (10g to 130g) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. reel sizes: molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13") reels (with c-7280). note that 13 reels are preferred. 4. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia-556. embossed carrier tape configuration: figure 1 notes 1. b1 dimension is a reference dimension for tape feeder clearance only. 2. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 3. tape with components shall pass around radius r without damage (see sketch a). the minimum trailer length (fig. 2) may require additional length to provide r min. for 12 mm embossed tape for reels with hub diameters approaching n min. (table 2) 4. the cavity defined by a 0 , b 0 , and k 0 shall be configured to surround the part with sufficient clearance such that the chip does not pro- trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mecha nical restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restric ted to 0.5 mm maximum in the pocket (not applicable to vertical clearance.) table 1 embossed tape dimensions (metric will govern) constant dimensions millimeters (inches) tape size d 0 ep 0 p 2 t max t 1 max 8 mm 1.5 1.75 0.10 4.0 0.10 2.0 0.05 0.600 0.100 and +0.10 -0.0 12 mm (0.059 (0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024) (0.004) +0.004, -0.0) variable dimensions millimeters (inches) tape size pitch b 1 max. d 1 min. f p 1 r min. t 2 max w a 0 b 0 k 0 note 1 note 2 note 3 note 4 8 mm single 4.4 1.0 3.5 0.05 4.0 0.10 25.0 2.5 8.0 0.30 (4 mm) (0.173) (0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012) 12 mm double 8.2 1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30 (8 mm) (0.323) (0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012) tantalum, ceramic and aluminum chip capacitors packaging information 94
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 embossed carrier tape configuration (cont.) sketch d: tape camber (top view) allowable camber to be 1 mm/250 mm. 250mm (9.843) 1mm (0.039) max. 1mm (0.039) max. table 2 C reel dimensions (metric will govern) figure 3: reel dimensions (metric dimensions will govern) tape size a max b* min c d* min n min w 1 w 2 max w 3 8 mm 330.0 1.5 13.0 0.20 20.2 50.0 8.4 14.4 7.9 min (12.992) (0.059) (0.512 0.008) (0.795) (1.969) +1.5, -0.0 (0.567) (0.311) see (0.331 10.9 max note 3 +0.059, -0.0) (0.429) 12 mm 330.0 1.5 13.0 0.20 20.2 table 1 12.4 18.4 11.9 min (12.992) (0.059) (0.512 0.008) (0.795) +2.0, -0.0 (0.724) (0.469) (0.488 15.4 max +0.078, -0.0) (0.606) tantalum, ceramic and aluminum chip capacitors packaging information figure 2: tape leader & trailer dimensions (metric dimensions will govern) 400mm (15.75) min. 20 95 packaging
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 20 20 maximum component rotation. typical component center line punched carrier (paper tape) configuration (ceramic chips only): table 1: 8 & 12mm punched tape ( metric dimensions will govern) variable dimensions - millimeters (inches) note: 1. a 0 , b 0 and t determined by the maximum dimensions to the ends of the terminals extending from the body and/or the body dimensions of the component. the clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (a 0 , b 0 and t) must be within 0.05mm (.002) minimum and 0.50mm (.020) maximum. the clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches a and b). 2. tape with components shall pass around radius "r" without damage. 3. kemet nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum. 8mm and 12mm 1.5 +0.10, -0.0 (.059 +0.004, -0.0) 1.75 0.10 (.069 0.004) 4.0 0.10 (.157 0.004) 2.0 0.05 (.079 0.002) 0.10 (.004) max. 0.75 (.030) min. 0.75 (.030) min. 25 (.984) see note 2 table 1 tape size d 0 p 0 e p 2 t 1 g 1 g 2 r min. 8mm 1/2 pitch 2.0 0.10 (.079 .004) see require- ments section 3.3 (d) 3.5 0.05 (.138 .002) 8.0 0.3 (.315 0.012) see note 1 table 1 1.1mm (.043) max. for paper base tape and 1.6mm (.063) max. for non- paper base compositions. see note 3. tape size p 1 w f a 0 b 0 t 8mm 4.0 0.10 (0.157 .004) 12mm 4.0 0.10 (0.157 .004) 12mm double pitch 8.0 0.10 (0.315 .004) 12.0 0.3 (.472 .012) 5.5 0.05 (.217 .002) table 1: 8 & 12mm punched tape ( metric dimensions will govern) constant dimensions - millimeters (inches) sketch b: max. component rotation - front cross sectional view sketch c: component rotation - top view a 0 b 0 p 1 p 0 p 2 d 0 f e w center lines of cavity 10 pitches cumulative tolerance on tape 0.2 ( 0.008) to p tape cover t user direction of feed t 1 max. cavity size see note 1 table 1 bottom tape cover g 2 r (min.) sketch a: bending radius see note 2 table 1 ceramic chip capacitors packaging information 96
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic chip capacitors packaging information capacitor marking table (marking optional - not available for 0402 size or y5v dielectric) a b c d e f g h j k l m n p q r s t u v w x y z a b d e f m n t y 0.10 0.11 0.12 0.13 0.15 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.40 0.45 0.50 0.60 0.70 0.80 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 24,000 27,000 30,000 33,000 36,000 39,000 43,000 47,000 51,000 56,000 62,000 68,000 75,000 82,000 91,000 25,000 35,000 40,000 45,000 50,000 60,000 70,000 80,000 90,000 100,000 110,000 120,000 130,000 150,000 160,000 180,000 200,000 220,000 240,000 270,000 300,000 330,000 360,000 390,000 430,000 470,000 510,000 560,000 620,000 680,000 750,000 820,000 910,000 250,000 350,000 400,000 450,000 500,000 600,000 700,000 800,000 900,000 alpha character numeral 9 01 2 3 4 5 capacitance (pf) for various numeral identifiers 1,000,000 1,100,000 1,200,000 1,300,000 1,500,000 1,600,000 1,800,000 2,000,000 2,200,000 2,400,000 2,700,000 3,000,000 3,300,000 3,600,000 3,900,000 4,300,000 4,700,000 5,100,000 5,600,000 6,200,000 6,800,000 7,500,000 8,200,000 9,100,000 2,500,000 3,500,000 4,000,000 4,500,000 5,000,000 6,000,000 7,000,000 8,000,000 9,000,000 7 10,000,000 11,000,000 12,000,000 13,000,000 15,000,000 16,000,000 18,000,000 20,000,000 22,000,000 24,000,000 27,000,000 30,000,000 33,000,000 36,000,000 39,000,000 43,000,000 47,000,000 51,000,000 56,000,000 62,000,000 68,000,000 75,000,000 82,000,000 91,000,000 25,000,000 35,000,000 40,000,000 45,000,000 50,000,000 60,000,000 70,000,000 80,000,000 90,000,000 6 laser marking is available as an extra-cost option for most kemet ceramic chips. such marking is two sided, and includes a k to identify kemet, followed by two characters (per eia-198 - see table below) to identify the capacitance value. note that marking is not available for size 0402 nor for any y5v chip. in addition, the 0603 marking option is limited to the k only. example shown is 1,000 pf capacitor. ka3 table 2 C capacitance values available in bulk cassette packaging 0402 0603 0805 all all c0g x7r y5v all all 109 109 109 221 221 221 221 221 104 104 all all 181 331 102 392 103 273 104 104 224 224 case size dielectric voltage min. cap value max. cap value all all 200 100 50 200 100 50 25 16 25 16 terminations: kemet nickel barrier layer with a tin overplate. 0.3 0.7 0.75 eia size code length l width w thickness t bandwidth b minimum separation s metric size code number of pcs/cassette 50,000 15,000 10,000 0402 0603 0805 1.0 0.05 1.6 0.07 2.0 0.10 0.5 0.05 0.8 0.07 1.25 0.10 0.5 .05 0.8 .07 0.6 .10 0.2 to 0.4 0.2 to 0.5 0.5 to 0.75 1005 1608 2012 table 1 C capacitor dimensions for bulk cassette packaging C millimeters unit: mm * reference 110 0.7 31.5 0 0.2 36 0 0.2 19.0* 5.0* 10* 53.3* 6.8 0.1 8.8 0.1 12.0 0.1 3.0 0 0.2 2.0 0.1 0 1.5 0 0.1 bulk cassette packaging (ceramic chips only) (meets dimensional requirements iec-286-6 and eiaj 7201) 97 packaging
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